As the electronic industry surges ahead, so does the need for practical insights and solutions to engineer the next generation of products. Enter DesignCon. With technical paper sessions, panels, tutorials, and boot camps spanning 14 tracks, DesignCon’s three-day conference program provides the information you need to solve design challenges now and plan how to improve designs in the future.
With leading suppliers on the expo floor, the latest in high-speed design tools, technologies, and developments will be on display at the DesignCon expo. DesignCon remains the place for chip, board, and systems design engineers to source, network, and stay ahead of industry change. In one lap of the floor, discover breakthrough solutions, free activities, networking events, educational sessions, and more.
Hosted in Silicon Valley, the heart of electronics innovation, DesignCon addresses chip, board, and system challenges facing design engineers. Sessions are provided for all levels of learning, with information for experienced engineers, recent graduates, and everyone in between.
From foundational to applicational, DesignCon conference areas include:
Signal and power integrity
Chip I/O and power modeling
Photonics and wireless in electrical design
Materials and processing for PCBs, modules, and packages
Advanced I/O interface design
High-speed link design
Signal processing, equalization, and coding/FEC
Power integrity in power distribution networks
Electromagnetic compatibility and interference
Test and measurement methodology
Interconnects modeling and analysis
Machine learning and AI
5G and communications